Bosch to invest EUR400 million in semiconductor production
By Will Hall - 20th April 2022
Germany – Weeks after opening its new silicon wafer fabrication facility in Dresden, Robert Bosch GmbH, based in Stuttgart, has announced it is to invest EUR400 million in its silicon chip manufacturing facilities throughout 2022. The investment will expand its wafer fabrication sites in Dresden and Reutlingen, Germany, and its semiconductor operations in Penang, Malaysia.
Most of the expenditure is earmarked for Bosch’s new 300-millimetre wafer fabrication facility in Dresden. Around EUR50 million will be spent at the Reutlingen site near Stuttgart. In Penang, Bosch is constructing a new semiconductor test centre from the ground up.